Development of modules for micro optical integration and MOEMS packaging

Brenner, Karl-Heinz

Document Type: Conference or workshop publication
Year of publication: 2000
Book title: MOEMS and miniaturized systems : 18 - 20 September 2000, Santa Clara, USA
The title of a journal, publication series: Proceedings of SPIE
Volume: 4178
Page range: 138-140
Publisher: Motamedi, M. Edward
Place of publication: Bellingham, Wash.
Publishing house: SPIE
ISBN: 0-8194-3834-0
Publication language: English
Institution: School of Business Informatics and Mathematics > Optoelektronik (Brenner 1999-2008)
Subject: 004 Computer science, internet
Abstract: For the transfer of micro optical and mechanical components to an application, packaging currently represents a major problem. The electrical, optical and mechanical components are typically fabricated with lithographic techniques. Thus the relative distances are accurate, but the absolute position on the substrate is defined by the quality of the separation tool. Thus active alignment is usually necessary for the assembly. For the development of standardized MOEM - modules, designed to eliminate the problems of alignment, technological, optical and functional considerations have to be addressed.

Dieser Eintrag ist Teil der Universitätsbibliographie.

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