For the transfer of micro optical and mechanical components to an application, packaging currently represents a major problem. The electrical, optical and mechanical components are typically fabricated with lithographic techniques. Thus the relative distances are accurate, but the absolute position on the substrate is defined by the quality of the separation tool. Thus active alignment is usually necessary for the assembly. For the development of standardized MOEM - modules, designed to eliminate the problems of alignment, technological, optical and functional considerations have to be addressed.
Dieser Eintrag ist Teil der Universitätsbibliographie.
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